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Lead-Free Initiative at Pro-face/Xycom
The electronics industry has been working to provide lead-free products in response to concerns about the environmental impact of the use of lead (Pb) in solder finishes. This effort is in response to increasing customer demand and directives from governments around the globe to decrease the amounts of consumer electronics waste.
As part of this effort, Pro-face is working with its suppliers and customers to comply with the European Restriction on Hazardous Substances.
Small amounts of lead have commonly been used in electronic products for many years. Lead is found throughout electronic components, component packaging, printed circuit boards (PCBs), and products. Pro-face estimates that approximately 90% of all electronic components contain some amount of lead.
The use of lead in electronic products has become an environmental concern and has been politically mandated for reduction in future products to minimize its impact on the environment. Although uncertainties remain about the potential for lead contained in electronic products to have any significant impact on human health or the environment. There are still many difficult scientific, technological and economic challenges associated with this initiative that affect the entire electronics industry. The transition to lead-free electronic products is a gigantic undertaking that will require the coordinating efforts by all members of the supply chain from raw material manufacturers to original equipment manufacturers (OEMs). Pro-face has dedicated some of its most knowledgeable resources to work with its suppliers towards achieving lead-free solutions.
Pro-face is committed to this effort by looking at appropriate, feasible, and cost-effective ways to reduce lead in its products. To accomplish this mission, Pro-face is working proactively with its suppliers and monitoring closely the activities of major electronic component manufacturers to ensure that lead-free initiative is in their future roadmap to support the migration away from tin-lead solder.
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